Press Release

Contact:
Karen Quatromoni
Industrial Internet Consortium
+1-781-444-0404 x146
[email protected]


THE INDUSTRIAL INTERNET CONSORTIUM DISCUSSES SMART FACTORY SOLUTIONS AT PACK EXPO

Smart manufacturing solutions for processing and packaging

CHICAGO, IL – AUGUST 6, 2018 – The Industrial Internet Consortium® (IIC™), the world’s leading organization transforming business and society by accelerating the adoption of the Industrial Internet of Things (IIoT), today announced it will exhibit at PACK EXPO International as part of the PACK EXPO International Partner program. With more than 2,500 exhibitors and 50,000 attendees, PACK EXPO International is the world’s largest packaging trade show.

CONFERENCE: PACK EXPO International
DATES: October 14-17, 2018
LOCATION: McCormick Place, Chicago, IL, USA
BOOTH #: Booth N-6001

“Smart manufacturing solutions are essential for the packaging and processing of manufactured goods,” said John Kowal, Chair of the IIC Smart Factory Task Group and Director Business Development, B&R Industrial Automation. “At PACK EXPO International, we are delighted to share what we have learned about smart manufacturing from working with manufacturing-related testbeds. IIC testbeds allow us to test products, solutions and processes in order to enhance efficiencies for smart factories.”

About Industrial Internet Consortium
The Industrial Internet Consortium is the world’s leading organization delivering transformative business value to organizations, industry, and society by accelerating adoption of a trustworthy internet of things. The Industrial Internet Consortium is a program of the Object Management Group (OMG). For more information visit www.iiconsortium.org.

Note to editors: Industrial Internet Consortium is a registered trademark of OMG. For a listing of all OMG trademarks, visit https://www.omg.org/legal/tm_list.htm. All other trademarks are the property of their respective owners.